TrinamiX’s Under-display Facial Recognition Passes Spoofing Tests

TrinamiX is celebrating a pair of major milestones after its Face Authentication solution achieved Android and FIDO certification. The company’s system is designed for use in smartphones, and was evaluated for the Android Biometric Security Test and the FIDO Alliance’s Biometric Component Certification Program.

In both cases, Face Authentication met the standards for the highest level of compliance. In the Android Test, it did not accept any false positives and received Class 3 (strong) certification with a Spoof Acceptance Rate of zero percent. The FIDO Alliance similarly granted the solution Level C approval, indicating that the system essentially cannot be spoofed.

What makes the feat even more impressive is that it delivered those results while the Face Authentication hardware was placed behind an OLED screen. Face Authentication is the first security solution to clear that technological hurdle.

For its part, TrinamiX argued that Face Authentication’s under-the-display capabilities make it ideal for smartphone deployments, since manufacturers will be able to eliminate the notch while delivering top-of-the-line biometric security. The setup consists of a camera, a dot projector, and a flood illuminator, and comes with a skin detection system that can distinguish human skin from other materials (such as those that might be used in a mask) to provide an extra degree of passive liveness detection. TrinamiX credited the technology for its strong performance in the FIDO and Android tests.

“This is where we see huge potential in facial biometrics – if smartphone manufacturers are able to close the security gaps that common technologies still have,” said TrinamiX 3D Imaging Business Director Stefan Metz. “Our goal is to give smartphone brands a greater freedom of design and to allow for sleek, maximum display designs.”

TrinamiX is pushing Face Authentication for Android phones, and noted that it can be used for sensitive applications like mobile payments. The company debuted its 3D imaging solution at MWC Shanghai in February of 2021.

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February 8, 2022 – by Eric Weiss