MetaOptics Ltd, a Singapore-based metalens technology company, has released details of a next-generation compact optical module for 3D non-contact fingerprint biometrics, targeting a total module thickness of approximately 5mm that would make integration into smartphones and notebooks feasible. The development marks a significant step beyond the conceptual demonstrations the company presented at CES 2025 and CES 2026.
The core engineering advance is the replacement of mechanical focusing, typically achieved via voice-coil motor (VCM) actuation used in conventional camera modules, with electronic tuning via a liquid crystal (LC) layer. The module stacks two ultra-thin metalenses, each 2.0mm in diameter on 0.775mm glass substrates, separated by an approximately 100-micrometer LC layer. Applying voltage across the LC layer adjusts the optical characteristics electronically, enabling what MetaOptics describes as an “active” optical architecture without any moving parts.
“With this next-generation tunable metalens solution, we are targeting a significant reduction in module size down to approximately a 5mm encapsulation, enabling mounting in space-constrained consumer electronics such as 5G smartphones and notebooks,” the company said in its development update. “Importantly, while many biometric modules in the market are passive, our tunable metalens stack enables an ‘active’ optical architecture, electronically adjustable to optimise fingerprint capture.”
Dr. Tobias W. W. Mass, VP Systems at MetaOptics, said the liquid crystal approach was selected for its maturity and optical design flexibility. “Applying this experience to realise an autofocus mechanism for a metalens imaging system is a logical step for MetaOptics. We selected an LC tuning approach because it is a mature technology platform with high optical design freedom while maintaining fully electronic actuation,” he said.
The current demonstrator uses green-wavelength (532nm) light and a monochrome sensor to capture detailed fingerprint features. MetaOptics is developing the module in collaboration with an unnamed Singapore national semiconductor commercialization institute. The company states the tunable metalens approach supports scalable manufacturing and improved yield compared to VCM-based alternatives.
MetaOptics first demonstrated its contactless 3D biometric sensor at CES 2025; today’s tunable metalens module is the next-generation development, shrinking the module to the 5mm encapsulation target. The development is part of a broader industry push toward new fingerprint form factors, with other companies also moving fingerprint sensing beyond the traditional under-display sensor footprint.
The company, listed on Singapore’s Catalist exchange, emphasized that the 5mm form factor could enable sub-surface 3D fingerprint scanning in consumer devices without requiring a camera bump or dedicated sensor cutout. The technology remains in the development collaboration phase; no commercial product timeline has been announced.
Sources: PR Newswire
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By the ID Tech Editorial Team
